gufotora (laser etching ikoreshwa muri microelectronics)
Bismaleimide (BMI) resin ni ibikoresho bya polymer byateye imbere bizwi cyane kubera imikorere idasanzwe mu bikorwa byo mu rwego rwo hejuru, cyane cyane mu bikoresho bya elegitoroniki na PCB (Printed Circuit Board). Hamwe nimiterere yihariye, resin ya BMI igenda ifatwa nkibikoresho byingenzi byo guhimba laminate yambaye umuringa (CCLs), aribikoresho fatizo bya PCBs.
Ibyiza byingenzi bya Bismaleimide Resin muri Porogaramu ya PCB
1.
BMI resin itanga ibikoresho byiza byamashanyarazi bifite agaciro gake Dk na Df, bigatuma biba byiza kuri sisitemu yitumanaho ryihuse kandi ryihuse. Iyi mitungo ningirakamaro mu gukomeza uburinganire bwibimenyetso muri sisitemu ikoreshwa na AI hamwe na 5G.
2. Kurwanya Ubushyuhe Bwihariye:
BMI resin yerekana ubushyuhe budasanzwe, hamwe nubushyuhe bukabije nta kwangirika gukomeye. Uyu mutungo utuma bikwiranye na PCBs zikoreshwa mubidukikije bisaba kwizerwa cyane no kwihanganira ubushyuhe, nk'ikirere, ibinyabiziga, hamwe na sisitemu y'itumanaho igezweho.
3. Gukemura neza:
BMI resin yerekana gukemura neza mumashanyarazi asanzwe, yoroshye gutunganya no guhimba CCLs. Ibi biranga bituma habaho guhuza neza mubikorwa byo gukora, kugabanya umusaruro utoroshye.
Porogaramu mu Gukora PCB
BMI resin ikoreshwa cyane muri CCLs ikora cyane, ituma umusaruro wa PCBs usaba nka:
Sisitemu ikoreshwa na AI
• Imiyoboro y'itumanaho 5G
• Ibikoresho bya IoT
• Ibigo byihuta byamakuru
Igisubizo cyibicuruzwa byihariye
Ibicuruzwa byacu bigira uruhare runini mubyiciro byose kandi bifite uburyo butandukanye bwo gusaba. Turashobora guha abakiriya ibikoresho bitandukanye bisanzwe, byumwuga kandi byihariye.
Murakaza nezatwandikire, itsinda ryacu ryumwuga rirashobora kuguha ibisubizo kubintu bitandukanye. Kugirango utangire, nyamuneka wuzuze urupapuro rwabigenewe hanyuma tuzakugarukira mumasaha 24.
